求翻译：1.圖3所示位置銘牌與鎂件的接觸面積過小，熱壓后有脫落風險，且此處小圓孔處銘牌熱壓后漏背光。2.圖3所示3個圓孔A、B、C直徑為2.0mm，熱壓后銘牌凹陷，已量產機種此孔直徑為1.5mm，熱壓后無凹陷現象是什么意思？

A contact area of ​​Figure 3 shows the location of the nameplate and magnesium parts is small, after shedding risk in the hot press, and here a small hole at the nameplate pressing leakage backlight. 2 Figure 3 shows the three hole a, b, c diameter of 2.0mm, hot pressing after the the nameplate depr

1. shown in Figure 3 place name plate with magnesium parts of the contact area too small to compression 后 have fallen off risks and here small round holes in name plate compression 后 backlight leakage. 2. shown in Figure 3 three round holes A, B, C diameter of 2.0 mm, compression 后 name plate dents,

1. shown in Figure 3 the position data plate and the magnesium contacted area excessively is small, after the thermo-compression has falls off the risk, after also here small round hole place data plate thermo-compression leaks the back light.2. shown in Figure 3 3 round hole A, B, the C diameter is

1. position as shown in Figure 3 nameplates and magnesium parts contact area is too small, hot-pressing after shedding risk, and here a small plate with a circular hole after hot press backlight leakage. 2. as shown in Figure 3-3 a, b, c with a circular hole diameter 2.0mm, hot-pressing nameplate af

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